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DST – CURIE Sponsored National Conference on “Packaging Techniques to Hasten Emergency Food Relief"Dept.of Food Processing and Preservation Technology Faculty of Engineering Avinashilingam University Coimbatore-21st and 22nd FEBRUARY 2014.

DST – CURIE Sponsored National Conference on “Packaging Techniques to Hasten Emergency Food Relief"Dept.of Food Processing and Preservation Technology Faculty of Engineering Avinashilingam University Coimbatore

Date of Function: 21st and 22nd FEBRUARY 2014.

1. Name of The Event: DST – CURIE Sponsored National Conference on “Packaging Techniques to Hasten Emergency Food Relief”

2. College Name:

Avinashilingam Institute for Home Science and Higher Education for Women University (Estd.u/s 3 of UGC Act 1956) (Deemed University under Category ‘A’ by MHRD) Coimbatore – 641043, TamilNadu, India. Re-accredited with ‘A’ Grade by NAAC

Faculty of Engineering

AyyaAvinashilingam Nagar

Varapalayam, Thadagam (PO)

Coimbatore – 641 108

Phone: 2658716, 2658145

3. Department:

Dept. of Food Processing & Preservation Technology and Dept. of Printing Technology

4. Event Details:(About your Event Description, Scope, Objective, Papers Topics): About the conference

The process of food packaging and related techniques, play a significant role in the food supply chain management for catastrophes. Supply of packed food to the victims and to the relief workers is a large scale operation involving: food-grade packaging items suited for mass production and immediate supply within short notice; efficient logistics where approaches to the destinations may be tampered; protected packaging of food and water that can withstand unpredictable environmental conditions, food supply chain building, humanitarian aid and emergency logistics. Many of the existing and emerging techniques in Supply Chain Management and Packaging can be applied to facilitate the Food Relief Process. The conference aims at throwing light on effectively applying these techniques to save the lives of a larger percentage of victims during calamities.

Topics

• Food package storage and distribution techniques

• Humanitarian logistics

• Package production techniques for food items

• Standards for food packages, food labels and food Supply chain

• Food Packaging materials, Renewable Materials and packaging alternatives

• Design of Food Packages and Food labels

• Intelligent and Smart Packaging

• Nanotechnology for food packaging

• Bio-Nano Technology in Food Packaging

• Sensors and tracking of Packages

• Printing inks for labeling on food packages

• Packaging Solutions for Food safety, Bio-security and Food security

• Sustainability of packages

• Food package disposal and environment friendliness

• Toxicological concerns in disposal of food packages

Conference Proceedings

Selected papers will be published in the conference proceedings by Elsevier ( In Process)

Paper Submission and Publication:

All papers need to be submitted via email to “pack4relief@gmail.com” as MsWord document. The materials presented in the papers should not be published or under submission elsewhere. Submit a full paper with maximum 8 pages, including figures and references, using 10 font and number each page. Authors (at least one) of any accepted paper are requested to register at the conference.

5. Date of Event: 21st and 22nd FEBRUARY 2014.

6. Important Dates:

Paper submission: February5, 2014

Notification of Paper Acceptance: February10, 2014

Conference Registration: February12, 2014

7. Contact Details:

Coordinators:

• Mrs.P. HemaPrabha - 9677972222

• Mrs. A. Arulmozhi – 9443652220

Email: pack4relief@gmail.com

8.Registration Fees:

Registration Category Amount

Academicians & Industry Rs. 1000 per delegate

Research Scholars Rs. 500 per delegate

Students Rs. 300 per delegate

Contact Information

Coordinators:

Mrs.P. HemaPrabha - 9677972222

Mrs. A. Arulmozhi - 9443652220

Email: pack4relief@gmail.com

More Information Please Click here

Source:Information(s) Provided By P.Hema Prabha Asst.Professor (senior scale) techsymposium member.
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Note: When submitting your papers to Event Convenors type email subject name as technicalsymposium.com /Your Paper title.

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